墨盒芯片焊接机 XJHP-2A
  • 产品详情


墨盒芯片焊接机 XJHP-2A  特点:

1、脉冲加热方式,因应不同产品,升温速度可供设置。 
2、独特自由浮动头设计,确保产品受压平均。 
3、备有真空功能,调节对位更方便,双工位旋转轮换送料,提升工作效率。 
4、温度数控化,清楚精密,可编程曲线包括预热及回流焊温度。 
5、备有数字显示压力开关,可预设压力范围,实现过压保护功能。 
6、PLC控制,7寸彩色触摸屏LCD显示输入,实时温度曲线显示。 
7、中文菜单,所有参数设置浏览简洁直观,操作简化。 

8、且置有密码保护,系统自检,故障报警显示功能。



墨盒芯片焊接机 XJHP-2A  技术参数:

1、定位冶具:2套
2、工作面积:150*150MM
3、温度精度:+2°c
4、温度设置:0~500°c
5、热压时间:0~99S
6、焊头材质:稀有金属
7、工作电压: AC 220V 
8、工作气压:0.5-0.7MPA 干燥气源
9、重量:62KG
10、外形尺寸:长610*宽450*高610MM

墨盒芯片焊接机 XJHP-2A  视频 :



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