墨盒芯片焊接机 XJHP-1A
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墨盒热压机  墨盒芯片焊接机 XJHP-1A 特点:
1、因应不同产品,升温速度可供调选。 
2、特种材料焊接头,确保产品受压平均。
3、备有真空功能,调节对位更容易。
4、温度数控化,精楚精密。 
5、备有数字式压力计,可预设压力范围。 
6、微电脑控制,精确稳定。 
7、可编程曲线包括预热及回流焊温度。 

8、适合各种墨盒焊接。




墨盒热压机 墨盒芯片焊接机 XJHP-1A 技术参数:

1、定位冶具:1套
2、工作面积:100*150MM
3、温度精度:+2°c
4、温度设置:0~500°c
5、热压时间:0~99S
6、焊头材质:稀有金属
7、工作电压: AC 220V 
8、工作气压:0.5-0.7MPA 干燥气源
9、重量:25KG
10、外形尺寸:长310*宽380*高400MM


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