Principle of laser spot solder paste soldering machine XJ-JX500:

The welding technology that uses semiconductor laser as the heat source to heat laser welding with solder paste can cover micro precision welding to large solder joint welding, and is widely used in the automotive electronics industry, semiconductor industry, mobile consumer electronics industry, 3C electronics, security control, intelligent manufacturing, LED industry and other products, such as motor stator, fan board, integrated circuit board, wiring harness electronics, through-hole components, pin components, PIN pins, optical communication, etc, Camera modules, automotive electronics, FPC soft boards, connector terminals, and other products.

Laser spot solder paste soldering machine XJ-JX500 features:

1. Laser solder paste welding only heats the solder joint locally, and has little thermal impact on the solder pad and component body.

2. After rapid heating to the set temperature and local heating, the solder joint cools quickly, forming an alloy layer quickly, and the joint structure is fine and reliable.

3. Laser solder paste welding belongs to non-contact processing, without the stress generated when the soldering iron contacts the solder, and without the generation of static electricity.

4. Fast temperature feedback speed, able to accurately control temperature to meet different welding needs.

5. Laser processing has high precision, precise control of tin content, and the laser spot range can be controlled between 0.2-5mm, which is much higher than traditional electric soldering.

6. No vulnerable consumables, saving operating costs, no contact welding, corresponding to complex welding points can also meet application requirements.

7. Multiple workstations can work together, with solder paste and welding stations working separately, greatly improving production capacity.

8. Equipped with high-speed closed-loop constant temperature control, strictly control every welding process, and accurately achieve fiber soldering reflow soldering based on the characteristics of solder paste.