Copper substrate stamping machine

  • Detail

Characteristics of the copper substrate stamping and splitting machine XJ360-10T:

1. Patent design, patent number: 2017200467605

2. Microcomputer control, Chinese and English human-machine exchange interface.

3. Compact structural design, super rigidity, easy to operate and safe to use.

4. Replace the mold according to different products, and the mold replacement is convenient and simple.

5. The lower mold automatically enters and exits, making it easy to retrieve and place products. The finished product can be dropped into the drawer.

6. Minimize the internal stress generated during plate cutting and avoid tin cracking.

7. The efficiency of punching semi-finished PCB, FPC, aluminum substrate, and copper substrate is extremely high.

Technical parameters of copper substrate stamping machine XJ360-10T:

Machine dimensions 730×810×1760 mm
Output 3T/5T10T/15T//25T
Working air pressure 0.5-0.70 MPA (dry air source)
Plate area three hundred × 350mm can be customized for larger areas
Machine weight 530 KG
Using voltage 220 VAC


Case Study of Copper Substrate Stamping Splitter XJ360-10T:



Copper substrate stamping machine XJ360-10T video:




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