一起见证 全新产品
发布日期：2024-10-21 17:17:34
在这个技术飞跃的时代，创新是引领发展的第一动力。从高密度封装技术、先进散热解决方案、柔性电路板技术，新材料的应用，再到智能制造的深入推动，无不引领着行业向更高效、环保和智能化的方向发展。
NEPCON ASIA 2024将集结150款新品首发，涵盖表面贴装技术、点胶喷涂、焊接、测试测量、SMT周边设备及电子材料、半导体封测、机器视觉、运动控制等电子制造及自动化产品，为服务于汽车、新能源、半导体、手机、电脑及电脑周边产品、家用电器、自动化及工控电子、医疗等应用领域的电子制造企业带来一系列降本增效的创新产品和解决方案，助力优化供应链，实现降本增效，从而全面提高行业竞争力。
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